Quad Flat Package (QFP) Definition
Quad Flat Package (QFP) is a packaging method for electronic components. It has a square shape with numerous thin leads extending from all sides, which can be soldered to a circuit board. Due to the large number of leads, QFP is suitable for connecting complex circuits and is used in devices such as computer processors and TV chips. This packaging type allows for lead pitches of 1.00mm, 0.80mm, 0.65mm, 0.50mm, 0.40mm, and 0.30mm, among others.
FAQs
The QFP is a surface mount integrated circuit package. The standard form is a flat rectangular body, usually square, with leads extending from all four sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB.
*Source:https://www.mouser.com
QFP packages contain leads that extend outwards on all sides in a gull-wing (or L) shape. However, QFN packages have no pin leads, hence the name (no-lead package). Instead, they contain metalized contacts on the underside.
*Source:https://www.ourpcb.com
Variants include the special-shaped quad flat package (1.4mm thickness) and the thin quad flat package (TQFP, 1.0mm thickness). Some manufacturers refer to the 0.5mm pitch QFP as a shrink QFP (SQFP or VQFP), while the 0.65mm and 0.4mm pitch versions are also called SQFP.
*Source:https://www.ic-components.com
Applications: LQFP packaging is commonly used for simpler electronic components, such as microcontrollers and memory chips, which require a lower pin count. On the other hand, QFP packaging is usually employed for more complex integrated circuits like processors, graphics chips, and communication chips.
*Source:https://www.yufanchip.com
Zero Defect
Quick-turn service
PCBA Manufacture
Learn how Keep Best can turn your designs into products.
