PCB Manufacturing Services

We use advanced manufacturing equipment to complete manufacturing tasks quickly and accurately, conduct strict quality control on the manufacturing process to ensure the quality of our products, and enable fast delivery to meet our customers’ urgent needs.

You can return or exchange goods without any reason

Your satisfaction are the best compliments to us.

PCB manufacturing process steps

1. Materials required for making PCB

copper clad laminate

It can be seen from the name that this material is related to copper, but it is not entirely made of copper. Instead, it is composed of fiberglass and epoxy resin, and is only covered with a layer of copper foil on the surface.

Photoresist

This is a photosensitive material, and the part exposed to ultraviolet light undergoes chemical changes when exposed to light. Photoresist is used in PCB manufacturing to create circuit patterns.

Etching liquid

This is a chemical agent that can dissolve copper and remove unnecessary copper in PCB manufacturing.

2. Surface treatment of copper clad laminate

Surface treatment is performed on the copper clad laminate to remove surface oxides and dirt and improve the adhesion of the photoresist.

3. Inner layer circuit production

The photoresist is applied to the copper-clad board according to the designed circuit pattern. The reaction between the photoresist and ultraviolet rays will produce chemical changes with the copper-clad board, and this change will form the required circuit pattern. Then use etching solution to remove excess copper, so that the inner circuit is formed.

4. Suppression

Multilayer copper-clad laminates and inner circuits are stacked together and pressed under high temperature and pressure to connect the layers together.

5. Drilling

According to the designed pattern, drill the required small holes on the PCB board. This small hole can connect various layers of circuits and components.

6. Electroplating

The outer layer of the circuit board also needs to be plated with a layer of copper, which can enhance the conductivity and corrosion resistance of the circuit board.

7. Outer circuit production

Similar to the inner layer circuit production, the required circuit pattern is formed on the outer copper clad board.

8. Surface treatment

In this step, it is necessary to apply a protective layer on the surface of the PCB, usually OSP/ENIG, etc. Special circuit boards will also have an immersion gold protective layer.

9. Test the pcb board

Test the PCB board to ensure that it has no quality problems and meets the design requirements.

10. Finished product

Cut the PCB into individual boards and package them.

PCB manufacturing materials:

  • Layer Count: 1 to 64 layers
  • Quality Levels: IPC Level 2 & 3
  • Copper Foil / Substrate: FR-4, S1141, High Tg, PTFE, Ceramic PCB, Polyimide, S1000-2, IT180A, Isola-FR408HR, FR406, Isola 370 HR, Rogers, Taconic, Arlon, Halogen-free options available
  • Copper Foil Brands: Kingboard, ITEQ, Shengyi, Nan Ya, Isola, TUC, SYL, Arlon, Nelco, Taconic, Hitachi, Rogers, etc.
  • High-Temperature Materials:
    • Conventional Tg: Shengyi S1141, KB6160, Huazheng H140 (not lead-free compatible)
    • Medium Tg: Suitable for HDI & multi-layer (SY S1000H, ITEQIT158, Huazheng H150, TU-662, SY S1150G, Huazheng H150HF, H160HF)
    • High Tg: Suitable for thick copper & high layer count (SY S1000-2, ITEQIT180A, Huazheng H170, ISOLA: FR408R, 370HR, TU-752, SY S1165)
  • High-Frequency Circuit Board Materials: Rogers, Arlon, Taconic, SY SCGA-500, S7136, Huazheng H5000
  • High-Speed PCB Materials: SY S7439, TU-862HF, TU-872SLK, ISOLA: I-Speed, I-Tera@MT40, Huazheng: H175, H180, H380
  • Ink: Taiyo Ink (Japan), Guangshun (China), Rongda (China), Kotsu Silk Screen (UK), S.M Material (Taiwan, China)
  • Aluminum Plate Thermal Conductivity: 1.0 W/mK
  • Chemicals: Rohm and Haas (USA), Atotech (Germany), Umicore (Germany)

Printed circuit board types

  • Prototype PCB
  • Rigid PCB
  • Flexible PCB (FPC)
  • Rigid-flex PCB
  • HDI PCB (High-Density Interconnect)
  • High Tg PCB
  • BGA PCB (Ball Grid Array)
  • Impedance Control PCB
  • IMS PCB (Metal Core PCB, LED PCB board)
  • Multilayer PCB

PCB Manufacturing Specifications:

  • Maximum board size: 609 * 889 mm
  • Board thickness: 0.1-8.0 mm
  • Board thickness tolerance: ±0.1 mm/±10%
  • Minimum base copper thickness:
    • Outer layer: 1/3oz (12um) ~10oz | Inner layer: 1/2oz~6oz
  • Maximum finished copper thickness: 6 OZ
  • Minimum mechanical drill hole size: 6mil (0.15 mm)
  • Minimum laser drill hole size: 3mil (0.075 mm)
  • Minimum CNC drill hole diameter: 0.15 mm
  • Hole wall roughness (maximum): 1.5mil
  • Minimum line width/spacing (inner layer): 2/2mil (outer layer: 1/3oz, inner layer: 1/2oz) (H/H OZ base copper)
  • Minimum line width/spacing (outer layer): 2.5/2.5mil (H/H OZ base copper)
  • Minimum hole-to-inner-layer conductor spacing: 6mil
  • Minimum hole-to-outer-layer conductor spacing: 6mil
  • Minimum annular ring width of through-hole: 3mil
  • Minimum annular ring width of component hole: 5mil
  • Minimum BGA diameter: 8mil
  • Minimum BGA spacing: 0.4 mm
  • Minimum finished hole diameter: 0.15 mm (CNC) | 0.1 mm (laser)
  • Half-hole diameter: The minimum half-hole diameter is 1 mm, and the half-hole is a special technology, so the half-hole diameter should be greater than 1 mm.
  • Hole wall copper thickness (thinnest): ≥0.71mil
  • Hole wall copper thickness (average): ≥0.8mil
  • Minimum air gap: 0.07 mm (3mil)
  • Fine SMD spacing: 0.07 mm (3mil)
  • Maximum aspect ratio: 20:01
  • Minimum solder mask bridge width: 3mil
  • Solder mask/circuit processing method: Film | LDI
  • Minimum insulation layer thickness: 2mil
  • HDI and special type PCB:
    • HDI (1-3 steps) | R-FPC (2-16 layers) | High-frequency hybrid pressure casting

we can provide you with :

What everyone is asking

A single-layer board has only 1 laver, while a multi-laver PCB has more than two layers.

Yes. we offer multilaver PCB manufacturing with dense and hiah count multilaver boards.

We can provide the highest precision boards with up to 2 to 64 layers.

Depending on the project, our delivery schedule can vary from 24 hours to 2 weeks.

Just upload Gerber files, BOM files and design files, and the Keepbest team will provide a complete quotation within 24h.

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Fill in your requirement information and upload Gerber and BOM files, we will give you a quote within 24 hours.

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Fill in your requirement information and upload Gerber and BOM files, we will give you a quote within 24 hours.

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