Ball Grid Array Definition
Ball Grid Array (BGA) is a packaging method for electronic components, featuring numerous small spherical solder joints (solder balls) on the bottom. These balls replace traditional leads and are used to connect the component to a printed circuit board (PCB), primarily for use in high-density circuits.
FAQs
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
*Source:https://en.wikipedia.org
LGA (Land Grid Array)
parts are similar to BGAs except that they do not have solder balls as leads but flat surface with pads. Most common LGAs are used as a physical interface for microprocessors. The contact between the device and component can be an LGA socket or it can be soldered directly to the PCB.
*Source:https://www.eurocircuits.com
FPGA stands for field programmable gate array, a type of integrated circuit that can be configured by a designer after manufacturing. BGA stands for ball grid array which is a type of integrated circuit packaging system where an array of solder balls are used to connect the substrate to the package pinouts.
*Source:https://ebics.net
BGA boards have more interconnections than normal PCBs, allowing for high-density, smaller sized PCBs. Since the pins are on the underside of the board, the leads are also shorter, yielding better conductivity and faster performance of the device.
*Source:https://miselectronics.com
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