Surface Mount Technology Definition
Surface Mount Technology (SMT) is a circuit assembly technique that mounts surface-mount components (SMC/SMD), which have no leads or short leads, onto the surface of a printed circuit board (PCB) or other substrates. The components are then assembled by soldering, typically using reflow soldering or wave soldering methods.
FAQs
An SMD, or surface-mounted device, is an electronic component that you would find on a board. An SMT, or surface mount technology, is the method of placing components (like an SMD) on the board. In electronic manufacturing services, the SMT process often works with SMDs, perhaps adding to the confusion.
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Surface mount technology (SMT) is the process wherein components are mounted onto the surface of a printed circuit board. The components are designed specifically to be directly mounted, rather than hardwired, onto the circuit board for the vast majority of electronics.
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Surface mount technology supports microelectronics by allowing more components to be placed closer together on the board. This leads to designs that are more lightweight and compact. The process for SMT production setup is faster when compared to through-hole technology.
*Source:https://www.protoexpress.com
Difficult Inspection : Due to the small size and many solder joints of most SMD components, it is very difficult to inspect. BGA packages have solder balls and joints under the component, very difficult to inspect. Also SMT inspection equipment is very expensive.
*Source:https://www.pcb-hero.com
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